The objective of Laser-Connect project is to generate and transfer a deeper understanding of ultrafast laser interactions and to push this so that it may be more competitively applied to the future manufacturing of thin film electronic devices.

From an application perspective, the project is primarily concerned with laser ablation and, in particular, with its application in a precision, high throughput, reconfigurable manufacturing systems such as:

  • touch panel screens,
  • high density circuit boards,
  • photovoltaics.







Laser-Connect is an Industry-Academia Partnership and Pathways (IAPP) project funded under the Marie Curie Actions programme in EU FP7.  Project Timeframe:  June 2010 - May 2014

‌‌EU Funding ‌‌  ‌